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Industrial Automation

Industrial Automation

VT-S730

PCB Inspection System

VT-S730

Omron's 3D-SJI (Solder Joint Inspection) Ensuring High-quality Products in an Efficient Manufacturing Environment

Hardware configuration

Model S730 S730-H
Dimensions 1100 (W) × 1470 (D) × 1500 (H) mm
Weight Approx. 800 kg
Power supply Voltage 200 - 240 VAC (single phase), voltage fluctuation range ±10%
Normal rated power 2.8 kVA 2.4 kVA
Line height 900 ±20 mm
Air supply pressure 0.3 - 0.6 MPa
Operating temperature range 10 - 35°C
Operating humidity range 35 - 80%RH (Non-condensing)
Image signal
input block
Imaging system 4M pixel camera 12M pixel camera
Inspection principle 3D reconstruction through color highlight and phase shift technology
Image resolution 15 μm
FOV 30.00 × 30.72 mm 61.44 × 46.08 mm

Functional specifications

Model S730 S730-H
Supported PCB size 50 (W) × 50 (D) - 510 (W) × 460 (D) mm
Thickness 0.4 - 4 mm
Clearance Above: 40 mm; Below: 40 mm
Height measurement range 25 mm
Inspection item Component height, lift, tilt, missing/wrong component, wrong polarity, flipped
component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet
(height/length, end joint width, wetting angle, side joint length), exposed land,
foreign material, land error, lead offset, lead posture, lead presence, solder ball,
solder bridge